AI · SEMICONDUCTOR · FACT CHECK
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Hanmi Semiconductor has signed a supply contract with Samsung Electro-Mechanics worth 24.5 billion won covering MSVP equipment, the company announced. The deal adds to a string of supply agreements by the semiconductor equipment maker, whose business has been buoyed by demand tied to advanced chip packaging.
The agreement, valued at 24.5 billion won, covers the supply of MSVP equipment to Samsung Electro-Mechanics. Hanmi Semiconductor disclosed the contract through standard regulatory disclosure, with the counterparty named as Samsung Electro-Mechanics.
MSVP refers to equipment used in semiconductor packaging processes, a segment where Hanmi Semiconductor has built its core business. The company supplies vision placement and related bonding equipment used in advanced packaging for high-performance chips, including products linked to the HBM supply chain.
Hanmi Semiconductor has been one of the notable beneficiaries of the AI-driven boom in high-bandwidth memory, as memory makers expand capacity for chips that accompany GPUs in AI servers. Contracts for packaging equipment have formed a growing share of the company's order book as customers ramp up production.
Samsung Electro-Mechanics, the contracting party, is a major electronics components manufacturer within the Samsung group, producing items including camera modules, multilayer ceramic capacitors, and semiconductor package substrates.
The contract value of 24.5 billion won represents a single supply agreement; the companies did not indicate in the disclosure a delivery schedule or further contract options beyond the stated amount.
The deal is True.
