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Hanmi Semiconductor managing director Kim Byung-seok has received the Tin Tower Industrial Medal, one of South Korea's industrial service honors, in recognition of a career spent almost entirely on TC (thermocompression) bonder technology spanning 35 years.
Kim has dedicated his career at Hanmi Semiconductor to the development of the company's TC bonder equipment, which is used in advanced semiconductor packaging. Over 35 years, he has been associated with the company's rise as a leading supplier of TC bonders, a key tool for high-bandwidth memory (HBM) packaging.
The Tin Tower Industrial Medal is awarded to individuals recognized for contributions to industrial development. The award to Kim highlights the role of equipment engineering talent in South Korea's semiconductor supply chain, where Hanmi Semiconductor has established itself as a major TC bonder maker serving memory chip manufacturers.
The company has not released further details about the award ceremony or Kim's specific technical milestones beyond the 35-year figure cited in the honor.
The claim that Hanmi Semiconductor managing director Kim Byung-seok received the Tin Tower Industrial Medal for his 35 years devoted solely to TC bonder development is True.