Mostly True
Samsung Electronics and SK hynix have both moved into co-packaged optics (CPO), a next-generation technology that integrates optical components directly with semiconductor packages, according to an Edaily report.
The claim under review stated that Samsung and SK have entered the CPO market. An Edaily article published May 4, 2026, reported that the two Korean chipmakers have joined the development of CPO technology alongside global players, as AI workloads drive demand for faster and more energy-efficient data transfer between chips.
CPO moves optical interconnects from the board level into the chip package itself, reducing power consumption and latency in data centers running large language models and other AI applications. The technology is seen as a key evolution for AI infrastructure, and entry by Samsung Electronics — a major memory and foundry supplier — and SK hynix — a leading HBM producer — signals broadening Korean participation in the segment.
The Edaily report supported the claim that both companies have made moves into the space, leading to a finding that the assertion is largely accurate, though the depth and scale of each company's CPO involvement was not fully detailed in the reporting.
Samsung Electronics and SK hynix have indeed entered the CPO field, making the claim mostly true.
Verdict: Mostly True