Order Details

The equipment supply contract, disclosed through regulatory filing, covers back-end process equipment to be delivered to UTAC's Thai operation. The deal size places it in the mid-range of orders typically reported by Korean semiconductor equipment makers, below the disclosure threshold that requires larger contracts to be announced separately.

UTAC, a major provider of semiconductor assembly and testing services, operates packaging and test facilities across Southeast Asia, including its Thailand site.

Context for Hanmi Semiconductor

Hanmi Semiconductor is a key supplier of bonding equipment for advanced chip packaging, with its TC bonder products widely used in high-bandwidth memory (HBM) production. The company has been expanding its customer base beyond its core clients as demand for advanced packaging grows alongside AI chip production.

The company did not specify in the disclosure the exact equipment types or delivery schedule for the UTAC order.

The claim is assessed as True.