New Equipment Targets AI Packaging Demand

The FC Bonder 75 is built for the 2.5D packaging processes used in AI semiconductor production, a segment where bonding precision is critical to chip performance. The first shipment signals the company's entry into supplying this next-generation tool.

2.5D packaging has become a key step in manufacturing high-performance AI chips, allowing GPUs and high-bandwidth memory to be placed side by side on an interposer. Equipment capable of handling these advanced bonding requirements is in growing demand as AI chip production scales.

Key Supplier to Global Chipmakers

Hanmi Semiconductor is a major supplier of TC bonders for high-bandwidth memory production, counting SK hynix among its customers. The FC Bonder 75 extends the company's lineup into the bonding stage of 2.5D packaging, positioning it to serve AI chip packaging demand beyond HBM assembly.

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