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판정 리포트 · 완료 2026-10-14 11:22

한미반도체, 美 세미콘 웨스트 참가…HBM·2.5D 패키징 장비 선봬

사실

요약
/app/downloads/factcheck_hanmi_semiconwest_2026.md` 최종 판정: 사실 이미지: [P: https://www.hanmisemi.com/image/sub/view_img_bonder45.png] [P: https://www.hanmisemi.com/image/sub/view_img12_1.png]
근거 — 직접 열람한 1차 출처 12건
  1. https://www.semiconwest.org/
  2. https://expo.semi.org/west2026/Public/EventMap.aspx?shMode=E&ID=32435&thumbnail=1
  3. https://expo.semi.org/west2026/Public/eBooth.aspx?BoothID=683420&Nav=False
  4. https://web.archive.org/web/20261014021359/https://expo.semi.org/west2026/Public/eBooth.aspx?IndexInList=0&FromPage=Exhibitors.aspx&ParentBoothID=&ListByBooth=true&BoothID=683420&Nav=False
  5. https://www.hanmisemi.com/?module=Html&action=SiteProduct&sSubNo=2&sNo=6
  6. https://www.hanmisemi.com/?module=Html&action=SiteProduct&sSubNo=10
  7. https://www.news1.kr/industry/general-industry/6319371
  8. https://www.newsis.com/view/NISX20261014_0003825198
  9. https://biz.chosun.com/it-science/ict/2026/10/14/LVRMO4W2F5AANAZ2GEDGCP5FPI/
  10. https://news.einfomax.co.kr/news/articleView.html?idxno=4439153
  11. https://www.ebn.co.kr/news/articleView.html?idxno=1727749
  12. https://www.thelec.kr/news/articleView.html?idxno=63546
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사실
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