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Hyundai Mobis has begun developing 13 types of automotive system semiconductors, the company said, with target vehicle models already selected for nine of them. The move is part of the auto parts supplier's push to develop its own system chips for vehicles.
The 13 semiconductor types span the automotive system chip categories Hyundai Mobis is developing in-house. For nine of the 13, the company has completed selection of the vehicle models in which the chips are intended to be deployed, according to the original report by Yonhap News.
The development effort reflects Hyundai Mobis's strategy to reduce reliance on externally sourced system semiconductors and strengthen its in-house capabilities in automotive electronics, a segment increasingly central to vehicle software and control systems.
While target vehicle selection has been finalized for nine chip types, the remaining four are at an earlier stage, with no target models yet announced. The report did not specify a timeline for mass production or the specific vehicle programs involved.
The claim is based on the company's announcement as reported by Yonhap News on October 21, with supporting images published alongside the article.
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