Honor for HBM Equipment Achievement

Kim, who serves as managing director (sangmu) at Hanmi Semiconductor, was decorated with the Eun-top Industrial Service Medal, one of South Korea's industrial service honors. The award cites his role in developing the company's TC bonder for high-bandwidth memory (HBM), a tool used in the thermocompression bonding process for HBM production.

The medal recognizes engineering work tied to a piece of equipment that has been central to Hanmi Semiconductor's position in the semiconductor equipment market, where its HBM TC bonder is supplied for advanced memory packaging.

Hanmi Semiconductor's Flagship Equipment Line

Hanmi Semiconductor has built its equipment business around the TC bonder line, with the HBM bonding tool standing out as its key product amid growing demand for HBM in the AI chip supply chain. The company's website materials reference the bonder product line among its core offerings.

The award to Kim underscores the company's engineering-led growth in the domestic semiconductor equipment sector, with the state decoration formally acknowledging individual technical contribution behind that product development.

The claim that Hanmi Semiconductor Managing Director Kim Byung-seok received the Eun-top Industrial Service Medal for his role in developing the HBM TC bonder is True.