AI · SEMICONDUCTOR · FACT CHECK
SKD WIRETrue
Hanmi Semiconductor is taking part in Semicon West in the United States, where it will present its HBM-related and 2.5D packaging equipment, according to the company.
The Korean semiconductor equipment maker's showcase centers on its HBM packaging equipment, including its bonder lineup, alongside gear for 2.5D advanced packaging. The company published product imagery of its bonder equipment on its official website in connection with the exhibition.
Semicon West is one of the industry's major gatherings for semiconductor manufacturing and packaging technology, giving equipment suppliers a platform to present solutions to chipmakers and packaging customers.
HBM's stacked-die structure requires precise die bonding, making bonding equipment a key link in the HBM supply chain. Advanced packaging formats such as 2.5D are also central to current AI chip designs, sustaining demand for the corresponding process equipment.
Hanmi Semiconductor has positioned itself as a supplier in this segment, and its Semicon West participation underscores its push to reach customers in the US market.
The claim that Hanmi Semiconductor is attending Semicon West to unveil its HBM and 2.5D packaging equipment is True.